发明名称 FLOOR MATERIAL FOR WIRING, AND METHOD OF MOLDING FLOOR MATERIAL FOR WIRING
摘要 PROBLEM TO BE SOLVED: To provide a floor material for wiring, which contributes to reduction of production costs. SOLUTION: The floor material 2 for wiring consists of a floor material main body 4 and a floor plate 5. The floor material main body 4 is formed of block sections 4a, 4a which are arranged at predetermined intervals so as to secure wiring grooves 3 therebetween. The floor plate 5 is extended over the block sections 4a, 4a adjacent to each other, so as to cover upper portions of the respective wiring grooves 3. Each main body section 41 of the floor material main body 4 and each main body section 51 of the floor plate 5 are molded of a mixture containing a plurality of types of plastics obtained by crushing plastic waste including various types of plastics. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008050873(A) 申请公布日期 2008.03.06
申请号 JP20060229282 申请日期 2006.08.25
申请人 MIRAI IND CO LTD;MIRAI KENSO KK 发明人 HANADA KOUHEI
分类号 E04F15/024;E04F15/18 主分类号 E04F15/024
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