| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of loosening a stress generated to a movable part of a function substrate due to linear expansion coefficient difference from a mounting board, and restraining deformation of a second cover substrate commonly used as a stopper for restraining excessive displacement of the movable part. SOLUTION: An acceleration sensor A, which is this semiconductor device, comprises a sensor substrate (function substrate) 1 having a movable part including an overlaying part 12 and each of flexion parts 13, a first cover substrate 2, and a second cover substrate 3 commonly used as a stopper restraining excessive displacement of the movable part in a direction opposite to the first cover substrate 2 on the sensor substrate 1. In this first cover substrate 2, an external connecting electrode 25 is positioned inner than a second electrical connecting metal layer 29 jointed to a first electrical connecting metal layer 19 of the sensor substrate 1, and a groove 20b for loosening the stress generated to the movable part together with joint of an external connecting electrode 25 and a conductor pattern 43 of a mounting board 40 is formed between both of them. COPYRIGHT: (C)2008,JPO&INPIT
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