发明名称 |
Soldering flux and solder paste composition |
摘要 |
A soldering flux contains a base resin and an activating agent. The soldering flux contains, as the activating agent, an oxygen-containing heterocyclic compound having at least one carboxyl group in a molecule. A solder paste composition contains the abovementioned soldering flux and the solder alloy powder. These enable exhibition of excellent wettability to lead-free metals and plating, irrespective of the type of the metals.
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申请公布号 |
US2008053571(A1) |
申请公布日期 |
2008.03.06 |
申请号 |
US20070896690 |
申请日期 |
2007.09.05 |
申请人 |
DENSO CORPORATION;HARIMA CHEMICALS, INC. |
发明人 |
YAMAMOTO MASAYASU;SHIOMI TAKUMI;NAKANISHI KENSUKE;WATANABE MASAHIRO;AIHARA MASAMI |
分类号 |
B23K35/363;B23K35/34 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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