| 摘要 |
A method for cleaning and drying a substrate in order to restrain formation of minute defects on a substrate surface when the substrate is dried by supplying the vapor of an organic solvent such as IPA. The method comprises the steps of: rinsing a surface of the substrate in a rising bath with pure water after wet processing of the substrate surface with liquid chemicals; lifting the substrate from the rinsing bath at a speed determined in advance by making a substrate surface hydrophobic, after rinsing the substrate; and removing moisture from the substrate surface by supplying an organic solvent to the substrate for a specified time, after lifting the substrate, the organic solvent being water soluble and lowering surface tension of the pure water.
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