| 摘要 |
The cooling device uses a sorption cooling system (22) with an evaporator (56), a sorption chamber (58), a desorption chamber (48) and a condenser (50), a partial exhaust gas flow (28) from the IC engine (12) diverted to the desorption chamber, for providing the required heat for desorption of the cooling medium in the sorption cooling system. The evaporator provides additional cooling of the cooling medium in the main cooling system (16,18) for the IC engine and/or cooling of a second partial exhaust gas flow. |
