| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus, or the like capable of preventing a functional module from being adversely affected by fine particles and corrosive gas generated when a processed substrate comes into contact with the atmosphere; in the substrate processing apparatus having a processing vessel for processing the substrate, an atmosphere conveyance chamber, and the functional module installed on the conveyance path of the substrate by a conveyance means in the atmosphere conveyance chamber. SOLUTION: The substrate processing apparatus, for example, for etching a wafer has a functional module, such as an orienter 4. A substance for generating corrosive gas, or the like in contact with the atmosphere is adhered to the wafer by processing. Meanwhile, a second air current formation means FFU 60 is attached to the functional module, thus forming clean air toward the atmosphere conveyance chamber 14 having a conveyance means of wafers from the functional module by taking in the air in the clean room. COPYRIGHT: (C)2008,JPO&INPIT
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