| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for preventing the deformation such as break or cut of a wire in a bonding process. SOLUTION: The manufacturing method comprises a step of mounting a lead frame 3 on a heat stage of a wire bonder; fixing a lead 3b to the heat stage 2 by a presser 5 having a structure of holding a gel material 6 containing silicon as a matrix between an upper and lower metal plates 5a, 5b, conducting ultrasonic waves to a wire 11, while a ball of the end of the wire 11 formed at the top end of a capillary 10 is pressed to a bonding pad on the circuit forming surface of a chip 4 to bond; and then moving the capillary 10 onto the lead 3b with feeding the wire 11 to conduct the ultrasonic waves to the wire 11, while the ball of the end of the wire 11 formed at the top end of the capillary 10 is pressed to the lead 3b to bond. COPYRIGHT: (C)2008,JPO&INPIT
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