| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrodeposited polyimide thin film which is deposited on a conductor metal such as copper and has excellent adherability. SOLUTION: The electrodeposited polyimide thin film is deposited from a polyimide electrodeposition solution by electrodeposition, which solution is an aqueous solution or a mixed solvent solution of water and an organic solvent, containing a polyimide compound selected from polyimide precursors each having carboxyl group in the molecular structure and anionic polyimides. A method for electrodepositing the electrodeposited polyimide thin film comprises using, as an anode, a base material formed from a metal, which ionizes and dissolves in the polyimide electrodeposition solution by an electrode reaction when a current is supplied for electrodeposition, and electrodepositing the thin film on the base material through a metal layer or a metal compound layer, which does not ionizes by an electrode reaction and does not dissolves in the polyimide electrodeposition solution when a current is supplied for electrodeposition. The electrodeposited polyimide thin film is deposited by the method. COPYRIGHT: (C)2008,JPO&INPIT
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