发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
摘要 Chip capacitors 20 are provided in a printed circuit board 10 . In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
申请公布号 US2008055872(A1) 申请公布日期 2008.03.06
申请号 US20070928397 申请日期 2007.10.30
申请人 IBIDEN CO., LTD. 发明人 INAGAKI YASUSHI;ASAI MOTOO;WANG DONGDONG;YABASHI HIDEO;SHIRAI SEIJI
分类号 H05K7/02;H01L21/48;H01L23/498;H01L23/50;H01L23/64;H01L25/16;H05K1/02;H05K1/18;H05K3/46 主分类号 H05K7/02
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