| 摘要 |
A production method of a multilayer electronic device, comprising the steps of forming a green sheet 10 a; forming an electrode layer 12 a on a surface of the green sheet 10 a; stacking the green sheets 10 a, each having the electrode layer 12 a thereon, to form a green chip; and firing the green chip: wherein before stacking the green sheet 10 a having the electrode layer 12 a formed thereon, an adhesive layer 28 is formed on a surface on the electrode layer side of the green sheet 10 a having the electrode layer 12 a formed thereon; and the green sheet 10 a having the electrode layer 12 a formed thereon is stacked via the adhesive layer 28.
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