发明名称 |
SEMICONDUCTOR PACKAGE HAVING NON-ALIGNED ACTIVE VIAS |
摘要 |
A semiconductor package is disclosed including a first capture pad isolated from an adjacent second capture pad by an insulator; a first plurality of electrically active vias connecting the first capture pad to the second capture pad; a third capture pad isolated from the second capture pad by an insulator; and a second plurality of electrically active vias connecting the second capture pad to the third capture pad. Each via of the first plurality of active vias is non-aligned with each via of the second plurality of active vias. The structure provides reduction of strain on the vias when a shear force is applied to a ball grid array used therewith while minimizing the degradation of the electrical signals.
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申请公布号 |
US2008054482(A1) |
申请公布日期 |
2008.03.06 |
申请号 |
US20060469950 |
申请日期 |
2006.09.05 |
申请人 |
AUDET JEAN;GUERIN LUC;QUESTAD DAVID L;RUSSELL DAVID J |
发明人 |
AUDET JEAN;GUERIN LUC;QUESTAD DAVID L.;RUSSELL DAVID J. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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