SURFACE MODIFICATION OF INTERLAYER DIELECTRIC FOR MINIMIZING CONTAMINATION AND SURFACE DEGRADATION

摘要

A semiconductor system includes: providing a dielectric layer (104); providing a conductor (108) in the dielectric layer (104), the conductor (108) exposed at the top of the dielectric layer (104); capping the exposed conductor (108); and modifying the surface of the dielectric layer (104); modifying the surface of the dielectric layer (104); wherein modifying the surface includes cleaning conductor (108) ions from the dielectric layer (104) by dissolving the conductor (108) in a low pH solution, dissolving the dielectric layer (104) under the conductor (108) ions, mechanically enhanced cleaning, or chemisorbing a hydrophobic layer (800) on the dielectric layer (104).