EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing optical semiconductor elements, capable of preserving transparency and obtaining sufficient durability even when exposed in a high temperature or ultraviolet irradiation for a long time after cured.

SOLUTION: The epoxy resin composition for sealing optical semiconductor elements comprises (A) an epoxy resin, (B) a curing agent and (C) a curing promotor as essential ingredients. As the (A) ingredient, (A-1) a hydrogenated epoxy resin obtained by hydrogenation of an aromatic epoxy resin and having ≥800 molecular weight and (A-2) triglycidyl isocyanurate are used. As the (B) ingredient, an acid anhydride is used. The (A-1) ingredient of 5-50 mass% and the (A-2) ingredient of 5-20 mass% are contained based on the total of the epoxy resin composition for sealing optical semiconductor elements.

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