| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing optical semiconductors which is less susceptible to disturbance light, exhibits enhanced light transmitting efficiency between the internal light emission and detection devices, prevents malfunctions, exhibits excellent flame resistance, moisture resistance, moldability, physical properties of the hardened products while achieving excellent environmental soundness in manufacturing not only single channel optical semiconductor devices but also multi-channel optical semiconductor devices. <P>SOLUTION: The resin composition contains an epoxy resin, a hardener, silica powder, titanium dioxide and a metal hydroxide. The surface of the metal hydroxide are coated with at least one kind selected from among aluminum compounds, silicon compounds and titanium compounds. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
