| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for laser processing with which, when a semiconductor wafer or other such workpiece is cut with a laser beam, the cutting of a base film itself is kept to a minimum, the local adhesion of the base film to a processing table is prevented, and subsequent steps can be easily and efficiently carried out. <P>SOLUTION: An adhesive sheet for laser processing comprises a base film 12 and an adhesive layer 11 laminated on the surface of the base film, wherein the base film has a melting protection layer 17 on the back side thereof. The structure of the melting protection layer is selected from: a structure (1) where a metal layer 14 is formed on a resin film 13, and this is pasted on the base film 12 via the adhesive layer 11, or is pasted by thermal laminating to form the melting protection layer; a structure (2) where an inorganic compound is dispersed upon the extrusion of a polymer to form a layer 10, and the layer 10 is pasted on the base film 12 to form the melting protection layer or; a structure (3) where an organic compound film 16 is formed, and this is pasted on the base film 12 to form the melting protection layer. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
