FORMING METHOD OF LOW-DIELECTRIC CONSTANT AMORPHOUS SILICA-BASED COATING AND LOW-DIELECTRIC CONSTANT AMORPHOUS SILICA-BASED COATING OBTAINED BY THIS METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of stably forming a low-dielectric constant amorphous silica-based coating having a small relative dielectric constant of not more than 3.0 and coating strength of Young's elasticity modulus of not less than 3.0 GPa on a substrate. SOLUTION: The forming method of the low-dielectric constant amorphous silica-based coating at least processes in steps including (a) a step of applying a liquid composition containing a hydrolyzate of an organic silicon compound obtained by hydrolysis to a substrate in the presence of tetraalkyl ammonium hydroxide (TAAOH); (b) a step of housing the substrate in an apparatus as required, and drying the coating formed on the substrate at a temperature condition of 25-340°C; (c) a step of introducing overheated steam into the apparatus to heat the coating at a temperature condition of 105-450°C to execute heating processing; and (d) a step of introducing a nitride gas into the apparatus as required, and baking the coating at a temperature condition of 350-450°C. COPYRIGHT: (C)2008,JPO&INPIT