SEMICONDUCTOR WAFER, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent occurrence of warp and a crack in a semiconductor wafer without using a support substrate or other substrates. SOLUTION: A semiconductor wafer reinforcing region 3 whose elastic modulus is larger than a semiconductor structure forming region 5 is formed at vicinity of an outer periphery of the semiconductor structure forming region 5 where semiconductor structures 6 of the semiconductor wafer 1 are formed. Elastic modulus continuously changes from the semiconductor structure forming region 5 to the semiconductor wafer reinforcing region 3. The thin semiconductor wafer 1 having the semiconductor structure 6 is manufactured through a process for forming the semiconductor structure 6 on a surface of the semiconductor structure forming region 5, and a process for polishing a rear face of the semiconductor wafer 1 and reducing thickness of the semiconductor wafer 1. COPYRIGHT: (C)2008,JPO&INPIT