| 摘要 |
PROBLEM TO BE SOLVED: To improve bonding strength of a circuit to hardly affect a processing tact, and to suppress increase of costs of equipment and a space for the equipment by plasma treatment of the surface of a connection electrode in the middle of a mounting line in the line for mounting the circuit on a display panel. SOLUTION: A method for mounting the circuit board to the display panel has an anisotropic conductive film pasting step of receiving the display panel 5 from a panel feeding position S1 by a moving means 8, to move the display panel to an anisotropic conductive film pasting 2a to paste an anisotropic conductive film on the connection electrode; a temporarily crimping step of crimping the circuit onto the connection electrode through the anisotropic conductive film; and an actual crimping step of crimping the circuit by applying pressure and heat between the circuit and the connection electrode of the display panel crimped temporarily. Further, the method is provided with a plasma treatment step of plasma-treating the surface of the connection electrode by a plasma generation means 13, while the display panel 5 is displayed from the panel feeding position S1 to the anisotropic conductive film pasting 2a. COPYRIGHT: (C)2008,JPO&INPIT
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