| 摘要 |
PROBLEM TO BE SOLVED: To provide an electron-beam wafer inspection device capable of shortening a time required for subjecting a wafer to an inspection process. SOLUTION: An inspection process for a wafer is carried out by a wafer inspection device, and a review process is carried out by an external apparatus connected to the wafer inspection device. That is, an inspection process and a review process are carried out in parallel. The inspection of a following wafer can be started without waiting for the finish of the review process. COPYRIGHT: (C)2008,JPO&INPIT
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