Conduction through a flexible substrate in an article

摘要

An article includes a first electrically-conductive circuit-path and a second electrically-conductive circuit-path. A portion of the first circuit-path is positioned proximally adjacent a portion of the second circuit-path at a first predetermined hole location. A first electrically-insulating barrier layer is interposed between the first circuit-path and second circuit-path at the first hole location, and the first circuit-path is conductively connected to the second circuit-path at the first hole location by filling the hole with a conductive filler. The conductive filler is configured such that the first circuit-path is conductively connected to the second circuit-path at the first predetermined hole location to form an interconnecting conductive filler-path between the first circuit-path and the second circuit-path.