发明名称 |
BARE MICROELECTRONIC CHIP PROVIDED WITH A RECESS FORMING A HOUSING FOR A WIRE ELEMENT CONSTITUTING A FLEXIBLE MECHANICAL SUPPORT, FABRICATION PROCESS AND MICROSTRUCTURE |
摘要 |
<p>A microelectronic chip (1) has two parallel main faces (4, 5) and lateral faces (6, 7). At least one of the faces (4, 5, 6, 7) has a recess provided with at least one electrical connection element and forming a housing for a wire element (10, 11). The wire element (10, 11) constitutes simultaneously an electrical connection between the chip (1) and the outside, via said connection element, and a flexible mechanical support for said chip.</p> |
申请公布号 |
WO2008025889(A1) |
申请公布日期 |
2008.03.06 |
申请号 |
WO2007FR01034 |
申请日期 |
2007.06.21 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE;VICARD, DOMINIQUE;MOUREY, BRUNO;BRUN, JEAN |
发明人 |
VICARD, DOMINIQUE;MOUREY, BRUNO;BRUN, JEAN |
分类号 |
H01L29/06;A41D1/00;H01L21/98;H01L23/48;H01L25/065 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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