发明名称 NON-CONTACT IC MEDIUM
摘要 <P>PROBLEM TO BE SOLVED: To provide a non-contact IC medium wherein an antenna is surely destroyed if an IC inlet of the non-contact IC medium packaged between external layer base materials is to be intentionally peeled off. <P>SOLUTION: The non-contact IC medium is constituted of packaging an IC chip 41 in which unique identification information is stored and a combined antenna 30 constituted of an antenna 31 made of conductive paste and an antenna 32 made of a metal or an alloy between external layer base materials 11, 12 made of paper or weak base materials through an adhesive layer 20a comprising an adhesive layer 21a having non-adhesive patterns 21a<SB>1</SB>, 21a<SB>2</SB>, 21a<SB>3</SB>, 21a<SB>4</SB>and an adhesive layer 22a having non-adhesive patterns 22a<SB>1</SB>, 22a<SB>2</SB>, 22a<SB>3</SB>, 22a<SB>4</SB>. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008052540(A) 申请公布日期 2008.03.06
申请号 JP20060228936 申请日期 2006.08.25
申请人 TOPPAN PRINTING CO LTD 发明人 OBA YASUSHI
分类号 G06K19/10;B42D15/10;G06K19/07;G06K19/077;H01Q1/40 主分类号 G06K19/10
代理机构 代理人
主权项
地址