| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermocompression bonding label for which the thermocompression bonding label containing an IC tag is surely bonded to a resin container without damaging an IC chip, and a resin container with an IC tag. <P>SOLUTION: The resin container with IC tag has the thermocompression bonding label 3 bonded to a container 5 made of thermosoftening resin in a tightly sealed manner. The thermocompression bonding label comprises an IC chip 12 for storing electronic information, a base material 14 whereon an antenna pattern electrically connected to the IC chip is formed, and a thermocompression layer 18 made of substantially the same material as the container made of thermosoftening resin, and they are laminated in the order of IC chip, base material, and thermocompression layer. A recessed part 56 processed to have a shape capable of housing at least the IC chip is formed on the container made of thermosoftening resin. By applying, in the state wherein at least the IC chip is housed in the recessed part, heat and pressure to the thermocompression layer in the outer part beyond the peripheral part of the base material, the thermocompression label is bonded in a tightly sealed manner to the container made of thermosoftening resin. <P>COPYRIGHT: (C)2008,JPO&INPIT |
