| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a method for removing a photoresist on a top surface of a substrate. SOLUTION: A substrate processing apparatus for removing a photoresist on a top surface of a substrate includes a supporting part 10 for supporting the substrate, a dry type processing part 20 for removing the photoresist on the top surface of the substrate, and a wet type processing part 30 for removing the photoresist on the top surface of the substrate. In a state of supporting the substrate by the supporting part, the photoresist on the top surface of the substrate is primarily removed by the dry type processing part 20, and is secondarily removed by the wet type processing part 30. The dry type processing part 20 has a plasma supply unit 200 and a moving unit for supplying plasma to the top surface of the substrate, and the moving unit changes a relative position of the plasma supply unit 200 and the substrate. COPYRIGHT: (C)2008,JPO&INPIT
|
