| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a polyimide wiring board by which the polyimide wiring board wherein the adhesiveness between a metal thin film and a polyimide is excellent and the metal thin film having a sufficient thickness is comprised can be manufactured without causing deformation of a substrate and a crack in the metal thin film. SOLUTION: The method for manufacturing the polyimide wiring board includes: a modification process wherein, as shown in Fig.4, a polyimide substrate 1 is treated with an alkaline solution to form a polyimide modifying layer 2 whose imide ring is opened; a metal ion adsorption process wherein the polyimide substrate is treated with a metal-ion- contained solution to make the modifying layer 2 adsorb a metal ion B; a mask pattern formation process wherein a mask pattern 3 is formed on the modifying layer to selectively expose the modifying layer; and a metal ion reduction process wherein the polyimide substrate 1 is reduced in a reduction bath to reduce the metal ion adsorbed by the modifying layer, thereby the metal thin film 4 is deposited in the exposed region of the modifying layer. COPYRIGHT: (C)2008,JPO&INPIT
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