| 摘要 |
In an assembly of a heat dissipating module and a computer housing, the computer housing has an interior adapted for receiving an electronic component, and a housing fan. The heat dissipating module includes a heat sink base and a fan. The heat sink base is provided on the electronic component, and the fan is provided on the heat sink base. The heat sink base absorbs heat generated by the electronic component, and the hot air around the heat sink base is drawn in by the fan and discharged directly toward the housing fan, which in turn extracts the hot air out of the computer housing. Thus, hot air around the electronic component is not likely to stay within the computer housing, thereby maintaining a normal operating temperature within the computer housing.
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