Leiterplatte mit eingebetteter elektrischer Vorrichtung und Verfahren zur Herstellung einer Leiterplatte mit eingebetteter elektrischer Vorrichtung

摘要

A printed wiring board (100) having an embedded electric device (41) is manufactured as follows. A first resin film (23) having an opening (35) or a sheet member (81) having a recess (82) is piled with a plurality of second resin films (23), on which a plurality of conductive layers (22) are formed. The first and second resin films (23) and the sheet member (81) include thermoplastic resin. An electric device (41) is inserted in the opening (35) or the recess. Then, the piled body including the electric device (41) is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes (42) of the electric device (41) are electrically connected to the conductive layers (22) while the first and second resin films (23) and the sheet member (81) plastically deformed to seal the electric device (41).