ADHESIVE DISPENSING FOR SEMICONDUCTOR PACKAGING

摘要

Methods and apparatus are disclosed to dispense adhesive for semiconductor packaging. A disclosed example shower head dispenser (40) includes a body (42) to receive adhesive from the dispenser, and a shower head tip (44) having a dispensing cavity (50) in communication with the body to dispense the adhesive in a pattern. The example shower head dispenser also includes a layer of non-stick material coating a contact surface of the dispensing cavity to reduce tailing of the adhesive.