CHIP FILM PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME

摘要

A chip film package and a display panel assembly having the same are provided to secure a margin of a gap between lower surfaces of leads by forming the leads with a shape of inverse trapezoid. A base film(110) is composed of an insulating material. A plurality of wiring patterns(122,124) are formed on the base film in order to compose a predetermined circuit. A plurality of leads(120,126) are formed at one end of the wiring patterns in order to be connected to an external terminal. A lower surface adjacent to the base film has a narrow width in comparison with an upper surface connected to the external terminal. A ratio between the width of the upper surface and the width of the lower surface is 0.6<=Wb/Wt<=1.