发明名称 Electronic module with removable circuitry and method for making
摘要 <p>An electronic module (40,50,60,70) and method that enable circuitry required by one form of the module (e.g., a developmental unit (40,50,60,70)) to be omitted in a second form of the module (e.g., a production unit (80)), without necessitating additional changes in the module (40,50,60,70). The electronic module (40,50,60,70) includes a motherboard (44,54,64,74), a multichip module (MCM) (12) mounted to the motherboard (44,54,64,74), and a circuit unit (10,110) connected to the MCM (12). The circuit unit (10,110) comprises a flexible substrate (18), instrumentation circuitry (14) mounted on the flexible substrate (18), and a connector (16) coupled to the flexible substrate (18). The flexible substrate (18) has signal lines that electrically communicate with the MCM (12), the instrumentation circuitry (14), and the connector (16). A portion of the flexible substrate (18) is located between the MCM (12) and the motherboard (44,54,64,74) and permits electrical communication therebetween. The instrumentation circuitry (14) does not occupy space on the motherboard (44,54,64,74). <IMAGE></p>
申请公布号 EP1531655(B1) 申请公布日期 2008.03.05
申请号 EP20040078123 申请日期 2004.11.15
申请人 DELPHI TECHNOLOGIES, INC. 发明人 BRANDENBURG, SCOTT D.;OMAN, TODD P.;MILLER, MICHAEL E.
分类号 H05K1/14;H05K1/18;H05K3/28;H05K3/34;H05K3/36;H05K7/14 主分类号 H05K1/14
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