| 摘要 |
<p>A die stack package is provided to shorten a process time and to reduce a material cost by using a nubbin for securing a space of a wire. A printed circuit board includes an electrode terminal formed on one surface thereof. A first die of an edge pad type is arranged on one surface of the printed circuit board. A first metal wire is formed to connect electrically a die bonding pad of the first die with the electrode terminal of the printed circuit board. A plurality of nubbins are formed on the first die. A second die includes a bonding pad which is arranged on the nubbins. A second metal wire is formed to connect electrically the bonding pad of the second die with the electrode terminal of the printed circuit board. A sealing agent is formed to seal one surface of the printed circuit board including the first and second dies and the first and second metal wires.</p> |
