DRY FILM PHOTORESIST RESIN COMPOSITION HAVING ENHANCED ADHESION

摘要

A resin composition for a dry film photoresist is provided to improve adhesion while maintaining other physical properties including resolution and hardness. A resin composition for a dry film photoresist comprises a copolymer containing allyl glycidyl ether as a polymer binder. The polymer binder is used in an amount of 15-40 wt% based on the total weight of the resin composition for a dry film photoresist. The allyl glycidyl ether comprises 5-50 wt% of the polymer binder on the solid content basis.