SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

摘要

A substrate processing apparatus is provided to prevent a process liquid from being scattered to the periphery of a substrate by immediately absorbing the process liquid after the process liquid is discharged from the discharge hole of a push-pull plate. A substrate support unit supports a substrate(W). A push-pull plate(2) is disposed to confront one surface of the substrate supported by the substrate support unit, separated from the one surface of the substrate by a predetermined interval. A plurality of discharge holes(22) for discharging the process liquid and a plurality of absorption holes(23) for absorbing the process liquid discharged from the discharge hole are formed on the confronting surface of the push-pull plate to the one surface of the substrate. A relative rotation unit relatively rotates the substrate supported in the substrate support unit and the push-pull plate. The substrate supported by the substrate support unit can be rotated round the periphery of an axis crossing the center of the substrate by the relative rotation unit.