SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing method is provided to prevent the dry mark of a cleaning solution from being left on a substrate by avoiding generation of more than one dry core in the periphery of the center of the substrate. Only one dry core functioning as a start point that a dry region is formed in a substrate(W) whose surface is covered with a cleaning solution is formed so that the dry region using the dry core as the start point can be broadened to the entire surface of the substrate. A discharge hole of a discharge nozzle is moved from a position confronting the center of the substrate to the circumference of the substrate. In the inner circumferential region where a distance to a position on the substrate confronting the discharge hole of the discharge nozzle is a radius, a first dry core that is a start point of forming a dry region on the substrate is generated and gas is blown from an injection hole of a gas injection nozzle(34) to the surface of the center part of the substrate before a second dry core is generated.