发明名称 METHOD OF MANUFACTURING INNER ELECTRODE FOR MULTI-LAYERED ELECTRONICS PARTS AND GREEN CHIP USING THE SAME METHOD
摘要 A method of manufacturing an inner electrode for multi-layered electronics parts and a green chip using the same are provided to remove a step between an inner electrode part and a non-inner electrode part which occurs at the time of stacking ceramic green sheets having the inner electrode. A method of manufacturing an inner electrode(30) for multi-layered electronics parts includes the step1 of, preparing a plurality of ceramic green sheets(10); step2 of forming a trench(20) having the same shape as a predetermined inner electrode pattern for each of the ceramic green sheets prepared in the step1; step3 of printing a predetermined inner electrode in the trench formed in the step2; and step4 of stacking the ceramic green sheets in which the inner electrode is formed in the step3. In the step4, the pattern having the same shape as the inner electrode is engraved or embossed. The trench is formed in a part in which the pattern is not formed by pressing an inner electrode forming processing member(40) and the ceramic green sheets to each other.
申请公布号 KR20080019890(A) 申请公布日期 2008.03.05
申请号 KR20060082384 申请日期 2006.08.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, SOON MOK;SONG, TAE HO
分类号 H01G4/30;H01G4/005 主分类号 H01G4/30
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