| 摘要 |
<p>A connecting material for bonding and connecting elements each having electrodes thereon in a correpondingly confronted relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electric conductance even in the case of bonding such elements as having a large number of electrodes arranged, thus, at a considerable small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temperature and high humidity, wherein the said connecting material comprises a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features comprising a modulus of elasticity of 1 - 12 GPa, a glass transition temperature Tg of 120 - 200 DEG C, a coefficient of linear expansion ( alpha 1) of 50 ppm/ DEG C or less at temperatures below the Tg and a coefficient of linear expansion ( alpha 2) of 110 ppm/ DEG C or less at temperatures above the Tg, wherein the difference ( alpha 2 - alpha 1) does not exceed over 60 ppm/ DEG C.</p> |
