发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A method for manufacturing a semiconductor device is provided to reduce defects due to stress and to enhance reliability by setting an optimum annealing condition. A method for manufacturing a semiconductor device includes an ion implantation process for implanting dopants onto a substrate. The method for manufacturing a semiconductor device includes further includes a drive-in process for performing a heat treatment process for the ion-implanted dopant. The heat treatment process is performed under a condition of temperature of 700 to 1000 ‹C during 20 to 40 minutes. A well region is formed by performing the drive-in process. The process temperature is inversely proportional to the process time.
申请公布号 KR20080020017(A) 申请公布日期 2008.03.05
申请号 KR20060082720 申请日期 2006.08.30
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 JANG, DUCK KI
分类号 H01L21/324 主分类号 H01L21/324
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