发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
A method for manufacturing a semiconductor device is provided to reduce defects due to stress and to enhance reliability by setting an optimum annealing condition. A method for manufacturing a semiconductor device includes an ion implantation process for implanting dopants onto a substrate. The method for manufacturing a semiconductor device includes further includes a drive-in process for performing a heat treatment process for the ion-implanted dopant. The heat treatment process is performed under a condition of temperature of 700 to 1000 ‹C during 20 to 40 minutes. A well region is formed by performing the drive-in process. The process temperature is inversely proportional to the process time.
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申请公布号 |
KR20080020017(A) |
申请公布日期 |
2008.03.05 |
申请号 |
KR20060082720 |
申请日期 |
2006.08.30 |
申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
JANG, DUCK KI |
分类号 |
H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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