| 摘要 |
A method for manufacturing a semiconductor package is provided to reduce a time for forming underfill by implementing an underfill using a powder type underfill forming material. Flip chip bonding on a semiconductor chip(100) is executed on a unit level substrate(140) of a strip level substrate including plural unit level substrates. Powder type filling materials are sprayed on a strip level substrate between the unit level substrates. By melting the powder type filling materials, the melted filling materials are injected between the unit level substrate and semiconductor chip. Then, the injected filling materials are cured.
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