发明名称 Cooling structure of electronic element
摘要 <p>A cooling structure of an electronic element is disclosed in which a smooth heat transfer can be carried out via a variety of heat transfer routes of conduction and convention without recourse to a forced cooling means such as a fan or the like, thus improving the cooling performance of electronic elements and stabilizing the operation of electronic circuits for a long period of time. </p>
申请公布号 EP1517602(A3) 申请公布日期 2008.03.05
申请号 EP20030028706 申请日期 2003.12.12
申请人 HYUNDAI MOTOR COMPANY 发明人 CHOI, KEE-HOON
分类号 H05K7/20;H01L23/36;H01L23/367;H05K1/02 主分类号 H05K7/20
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