| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device for optical communications by which dust and foreign matters or the like floating in air are prevented from entering a space between an optical device and an optical waveguide by forming a sealing resin layer between a printed board for packaging an IC chip and a multilayer printed wiring board and also whose reliability is high by mitigating stress caused by the difference in the coefficients of thermal expansion between the printed board for packaging the IC chip and the multilayer printed wiring board. <P>SOLUTION: The device for the optical communications is constituted of the printed board for packaging the IC chip where at least the optical device is packaged and the multilayer printed wiring board where at least the optical waveguide is formed, and an optical signal is transmitted by the optical waveguide and the optical device, and the enclosed resin layer is formed between the printed board for packaging the IC chip and the multilayer printed wiring board. <P>COPYRIGHT: (C)2004,JPO</p> |
