SEMICONDUCTOR PACKAGE WITH TRANSPARENT LID

摘要

In an optical integrated circuit device a transparent element (106) is mounted over at least the optically active elements (102) in order to provide protection for the integrated circuit during use. The transparent element 106 is retained in position by adhesive (105). The adhesive (105) is deposited between and maintained in position by a pair of ridges (104) provided around the optically active element or elements. The ridges (104) are formed from an organic photolithographic gel.