| 摘要 |
A BGA package is provided to shorten the path of electric signals by implementing conductive members for connecting a semiconductor chip and a substrate instead of bonding wires. A BGA(Ball Grid Array) package includes a substrate(100), a semiconductor chip(180), conductive members(200), a sealing part(220), and solder balls(240). The substrate includes circuit patterns, bond fingers(140) at an upper surface thereof, and ball lands at a lower surface thereof. The semiconductor chip is attached in face-down so as to arrange bonding pads on an upper surface of the bond fingers. The conductive members are formed between the bonding pads and the bond fingers. The sealing part seals an upper surface of the substrate including the semiconductor chip and conductive members. The solder balls are attached to the ball lands of the lower surface of the substrate. |
