| 摘要 |
To obtain a component-mounting method and a component-mounting apparatus, by which a component can be mounted on an electronic circuit substrate, while maintaining the inside of component-mounting space at a cleaning state. The component-mounting apparatus 1A is constituted so that the area of a component supply aperture part 14 in the component-mounting space 2 covered with a cover 10 is narrowed by a flap cover 33, a substrate carry-in aperture part 15A and a substrate carry-out aperture part 15B are also narrowed by a fixing plate 34 and a closing plate 35, as required, clean air is suckedfrom an upper air supply means 30, and in a state with the air pressure in the component-mounting space 2 being increased higher than the atmospheric pressure of outside air, a component from a component cassette 20 is carried to the surface of the electronic circuit substrate B through a substrate carrying conveyer 7. |
