PAD PART STRUCTURE OF A SEMICONDUCTOR DEVICE FOR DECREASING CHIP AREA AND MANUFACTURING METHOD THEREOF

摘要

A pad part structure of a semiconductor device for decreasing a chip area and a manufacturing method thereof are provided to reduce an area of a semiconductor chip by reducing a planar gap between upper and lower pad metals. A lower pad metal(103) is electrically connected to an internal circuit part(101) of a substrate. A first insulating layer(104) is formed on the lower pad metal. An upper pad metal(105) is formed on the first insulating layer in order to be electrically connected to the internal circuit part. A second insulating layer(106) is formed on the upper pad metal. A lower opening part(107b) and an upper opening part(107a) are formed on the first and second insulating layers, respectively in order to expose the upper and lower pad metals to the outside.