METHOD OF MANUFACTURING MULTI-LAYERED ELECTRONICS PARTS AND APPARATUS THEREOF

摘要

A method of manufacturing multi-layered electronic parts and an apparatus thereof are provided to prevent the occurrence of defects such as a crack, the delamination, and a pore of a sintered body. A method of manufacturing multi-layered electronic parts includes the step1 of preparing a pair of elastic plates having a plurality of planar portions and projections; the step2 of arranging a plurality of green chips spaced from each other in the planar portions between the pair of elastic plates prepared in the step1; the step3 of vacuum-packing the pair of elastic plates having the green chips arranged therein in the step2; and the step4 of hydrostatic-pressing a vacuum-packed body formed in the step3 at a predetermined temperature. The elastic plates prepared in the step1 are made of rubber. The hardness of the elastic plate is in the range of 20 to 60 degrees. Thicknesses of the pair of elastic plates are twice to five times larger than those of the green chips. The elastic plates are formed by stacking two to five layered rubber plates having a thickness of 1 to 2 mm.