| 摘要 |
<p>An adhesive sheet for water jet laser dicing is provided to obtain sufficient elongation upon pick-up after dicing while maintaining liquid permeability, to prevent generation of defects upon the removal of chips or IC parts, and to allow processing of a very thin semiconductor wafer or material. An adhesive sheet for water jet laser dicing comprises a substrate film and an adhesive layer stacked on the substrate film. The adhesive sheet includes perforations, and has a porosity of 3-90% and an elongation at break of at least 100%. The perforations pass through the adhesive layer from the substrate film. The substrate film comprises a layer containing polyolefin. The perforation has a diameter of 5-800 micrometers.</p> |
