| 摘要 |
<p>A stack package having a reverse pyramidal shape is provided to support stably a second semiconductor chip and to protect a first conductive wire by arranging an electronic element at an edge of the second semiconductor chip larger than a first semiconductor chip. A base substrate(10) includes an external connecting terminal, a plurality of first bonding pads, a plurality of second bonding pads, and a plurality of connective pads. A first semiconductor chip(100) is attached on an upper surface of the base substrate and includes a plurality of first bumps arranged along a first edge. A first conductive wire is formed to connect the first bumps with the first bonding pads. A second semiconductor chip(200) is larger than the first semiconductor chip and is stacked on the first semiconductor chip. The second semiconductor chip includes a plurality of second bumps arranged along a second edge. A spacer part(150) is attached between the first and second semiconductor chips to protect the first conductive wire. A second conductive wire(230) is formed to connect the second bumps with the second bonding pads. An electronic element(300) is formed to support the second semiconductor chip and to connect electrically the first and second semiconductor chips with each other.</p> |
