Thermal dissipation from a flip chip through an aperture in a flex cable

摘要

A semiconductor die mounted to a flex cable is provided. The flex cable comprises a heat sink layer and a flex cable substrate having conductive traces disposed thereon. The flex cable substrate includes an aperture aligned with the semiconductor die. A thermal conductor disposed within the aperture contacts both the semiconductor die and the heat sink layer. The thermal conductor can comprise, for example, a set of solder balls.