发明名称 Method for producing conductive particles
摘要 The present invention provides a low-cost method for producing conductive particles in a short period of time by simplifying pretreatment in electroless plating. The method for producing conductive particles includes the steps of: introducing a solution composed mainly of palladium chloride and hydrochloric acid into an electroless plating bath containing particles of an organic material or an inorganic material while stirring the bath; and simultaneously applying an electroless plating to the surface of the particles and allowing the palladium catalyst to be carried on the surface of the particles to give conductive particles having an electroless plate coating.
申请公布号 US7338686(B2) 申请公布日期 2008.03.04
申请号 US20040822695 申请日期 2004.04.13
申请人 KIYOKAWA PLATING INDUSTRY CO., LTD. 发明人 KIYOKAWA HAJIME;FUKUOKA KIYOTO
分类号 C23C18/30;C23C18/34;B05D7/00;B22F1/02;C23C18/16;C23C18/32;C23C18/38;C23C18/40;C23C18/50;H01B13/00 主分类号 C23C18/30
代理机构 代理人
主权项
地址