发明名称 Polycrystalline silicon film containing Ni
摘要 The present invention is related to a polycrystalline silicon film containing Ni which is formed by crystallizing an amorphous silicon layer containing nickel. The present invention includes a polycrystalline silicon film wherein the polycrystalline film contains Ni atoms of which density ranges from 2x10<SUP>17 </SUP>to 5x10<SUP>19 </SUP>atoms/cm<SUP>3 </SUP>on average and comprises a plurality of needle-shaped silicon crystallites. In another aspect, the present invention includes a polycrystalline silicon film wherein the polycrystalline film contains Ni atoms of which density ranges from 2x10<SUP>17 </SUP>to 5x10<SUP>19 </SUP>atoms/cm<SUP>3</SUP>, comprises a plurality of needle-shaped silicon crystallites and is formed on an insulating substrate. Such a polysilicon film according to the present invention avoids metal contamination usually generated in a conventional method of metal induced crystallization.
申请公布号 US7339188(B1) 申请公布日期 2008.03.04
申请号 US20000497508 申请日期 2000.02.04
申请人 LG.PHILIPS LCD CO., LTD. 发明人 JANG JIN;PARK SEONG-JIN
分类号 H01L29/04;H01L29/786;H01L21/20;H01L21/77 主分类号 H01L29/04
代理机构 代理人
主权项
地址